Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

ABSTRACT

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/787,041, filed Oct. 18, 2017, now U.S. Pat. No. 10,163,826; which isa divisional of U.S. application Ser. No. 14/506,423, filed Oct. 3,2014, now U.S. Pat. No. 9,812,415; which is a divisional of U.S.application Ser. No. 13/155,203, filed Jun. 7, 2011, now U.S. Pat. No.8,866,272; which is a divisional of U.S. application Ser. No.11/685,621, filed Mar. 13, 2007, now U.S. Pat. No. 7,955,898; each ofwhich is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure is related to packaged microelectronic devicesand methods for manufacturing packaged microelectronic devices.

BACKGROUND

Processors, memory devices, imagers and other types of microelectronicdevices are often manufactured on semiconductor workpieces or othertypes of workpieces. In a typical application, several individual dies(e.g., devices) are fabricated on a single workpiece using sophisticatedand expensive equipment and processes. Individual dies generally includean integrated circuit and a plurality of bond-pads coupled to theintegrated circuit. The bond-pads provide external electrical contactson the die through which supply voltage, signals, etc., are transmittedto and from the integrated circuit. The bond-pads are usually verysmall, and they are arranged in an array having a fine pitch betweenbond-pads. The dies can also be quite delicate. As a result, afterfabrication, the dies are packaged to protect the dies and to connectthe bond-pads to another array of larger terminals that is easier toconnect to a printed circuit board.

Conventional processes for packaging dies include electrically couplingthe bond-pads on the dies to an array of pins, ball-pads, or other typesof electrical terminals, and then encapsulating the dies to protect themfrom environmental factors (e.g., moisture, particulates, staticelectricity, and physical impact). In one application, the bond-pads areelectrically connected to contacts on an interposer substrate that hasan array of ball-pads. FIG. 1A, for example, schematically illustrates aconventional packaged microelectronic device 10 including an interposersubstrate 20 having an array of external contacts 22, a microelectronicdie 30 attached to the interposer substrate 20, and a plurality ofwire-bonds 32 electrically coupling the die 30 to the external contacts22 of the interposer substrate 20. The die 30 is attached to theinterposer substrate 20 with a generally flexible adhesive material 50(e.g., epoxy, tape, etc.). The die 30 has been encapsulated with acasing 60 to protect the die 30 and corresponding wire-bonds 32 fromenvironmental factors.

One drawback of this conventional arrangement is that stresses withinthe device 10 can cause the device 10 to bow or warp afterencapsulation. FIG. 1B, for example, is a view of the device 10 afterthe device has bowed, with the amount of bowing highly exaggerated forpurposes of illustration. The bowing can be caused by several factors,such as an asymmetrical stress distribution within the device caused bythe difference between the coefficients of thermal expansion of theinterposer substrate 20, the microelectronic die 30, and the casing 60.The generally flexible or compliant adhesive material 50 moves alongwith the substrate 20 and die 30, and does little or nothing to preventthe bowing or warpage of the device 10. The warpage can cause the solderlinks between the interposer substrate 20 and a printed circuit board(not shown) to which the interposer substrate 20 is attached to fail,and/or can cause the die 30, the interposer substrate 20, and/or thecasing 60 to delaminate. Such failures can cause electrical shorts thatrender the device 10 defective. Accordingly, there is a need to improvethe robustness of microelectronic devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a partially schematic side cross-sectional view of a packagedmicroelectronic device including an interposer substrate and amicroelectronic die configured in accordance with the prior art.

FIG. 1B is a partially schematic side cross-sectional view of themicroelectronic device of FIG. 1A after bowing has occurred.

FIGS. 2A-2C illustrate stages in a method for forming a packagedmicroelectronic device in accordance with an embodiment of theinvention.

FIGS. 3A and 3B illustrate stages in a method for forming a packagedmicroelectronic device in accordance with another embodiment of theinvention.

FIG. 4 is a schematic illustration of a system in which themicroelectronic devices may be incorporated.

DETAILED DESCRIPTION

Specific details of several embodiments of the disclosure are describedbelow with reference to packaged microelectronic devices and methods formanufacturing such devices. The microelectronic devices described belowinclude a single microelectronic die attached to a support member, butin other embodiments the microelectronic devices can have two or morestacked microelectronic dies electrically coupled to a support member.The microelectronic devices can include, for example, micromechanicalcomponents, data storage elements, optics, read/write components, orother features. The microelectronic dies can be SRAM, DRAM (e.g.,DDR-SDRAM), flash-memory (e.g., NAND flash-memory), processors, imagers,and other types of devices. Substrates can be semiconductive pieces(e.g., doped silicon wafers, gallium arsenide wafers, or othersemiconductor wafers), non-conductive pieces (e.g., various ceramicsubstrates), or conductive pieces. Moreover, several other embodimentsof the invention can have configurations, components, or proceduresdifferent than those described in this section. A person of ordinaryskill in the art, therefore, will accordingly understand that theinvention may have other embodiments with additional elements, or theinvention may have other embodiments without several of the elementsshown and described below with reference to FIGS. 2A-4.

FIGS. 2A-2C illustrate stages of a method for forming a packagedmicroelectronic device in accordance with one embodiment of thedisclosure. More specifically, FIGS. 2A-2C illustrate stages of a methodfor attaching a back side of a microelectronic die to a support memberwith a generally rigid solder-based attachment feature or structure. Therigid attachment feature can provide structural support and balance tothe stress distribution within the device, thereby resulting in lessstress within the individual components of the device and the interfacesbetween the components.

FIG. 2A, for example, is a partially schematic, side cross-sectionalview of a support member 202 and a microelectronic die 240 at an initialstage before the die 240 has been attached to the support member 202.The support member 202 can include an interposer substrate, a printedcircuit board, a lead frame, or another suitable support member. Thesupport member 202 can be composed of an organic material, a ceramicmaterial, or another suitable dielectric material. The support member202 can include a first side 204 and a second side 206 opposite thefirst side 204. In the illustrated embodiment, the support member 202 isan interposing device that provides an array of ball-pads for couplingvery small contacts on the microelectronic die 240 to another type ofdevice (not shown). The support member 202, for example, includes anarray of support member terminals 208 at the first side 204, an array ofcontact pads 212 (e.g., ball-pads) at the second side 206, and a trace214 or other type of conductive line between each support memberterminal 208 and one or more corresponding contact pads 212. The contactpads 212 are arranged in an array for surface mounting the device to aboard or module of another device. A plurality of electrical couplers216 (e.g., solder balls or conductive bumps) can be attached tocorresponding contact pads 212. In other embodiments, the support member202 can include different features and/or the features can have adifferent arrangement.

The support member 202 in the illustrated embodiment also includes anattachment feature or device 230 disposed on at least a portion of thefirst side 204 of the support member 202 (e.g., over at least a portionof a die attach region 220). The attachment feature 230 is used toprovide the connection between the support member 202 and the die 240,as described in greater detail below. The attachment feature 230 can becomposed of a solder material 231, such as a lead-free solder (e.g., aSnAgCu, SnAg, and/or SnAu solder), a solder having another composition,and/or other suitable materials or alloys of materials having thedesired properties. Solder compositions generally include anelectrically conductive metal and a flux composition. A wide variety ofelectrically conductive metals may be suitable. In one embodiment, forexample, the metal is selected to form a stable metallurgical bond withthe material of the die 240 to which the solder material 231 will beattached. The metal of the solder may also be selected to bemechanically and chemically compatible with the other components of theresulting microelectronic device.

The solder material 231 can be deposited onto the support member 202using a suitable deposition process, such as screen printing (e.g.,depositing a solder paste through a solder stencil) or other techniques.The solder material 231 may be deposited over all or a substantialportion of the die attach region 220 on the first side 204 of thesupport member 202, or the solder material 231 may be deposited in adesired pattern on the support member 202 (e.g., in the form ofindividual, discrete volumes of solder material arranged in a patternover the die attach region 220). Representative patterns are describedbelow with reference to FIGS. 3A and 3B. The support member 202 mayinclude a metal or conductive layer (not shown) over at least a portionof the front side 204 and positioned to contact and promote wetting ofthe solder material 231. In several embodiments, a volume of flux (notshown) may be applied to the solder material before the die 240 isengaged with the attachment feature 230. The flux can be applied, forexample, using a spraying process, a screen printing process, or anothersuitable technique.

The microelectronic die 240 can be a semiconductor die or other type ofmicroelectronic die. The die 240, for example, can be a processor, amemory device, an imager, a sensor, a filter, or other type ofmicroelectronic device. Suitable memory devices, for example, includeDRAM and flash memory devices. The die 240 includes an active or frontside 242 and a back side 244 opposite the active side 242. The active orfront side 242 generally refers to the side of the die 240 that isaccessed during formation of the active elements of the die 240. The die240 also includes integrated circuitry 246 (shown schematically) and aplurality of terminals 248 (e.g., bond-pads) electrically coupled to theintegrated circuitry 246. The terminals 248 are arranged in an array atthe active side 242 of the die 240. In the illustrated embodiment, thedie 240 also includes a conductive layer 250 deposited over at least aportion of the back side 244 of the die 240. The conductive layer 250may include, for example, a redistribution layer (RDL) applied to atleast a portion of the back side 244 to facilitate wetting of the soldermaterial 231 of the attachment feature 230. The RDL, for example, isdedicated to a function of providing a connection between the die 240and the support member 202. In other embodiments, the conductive layer250 may include a wettable, metalized layer over at least a portion ofthe back side 244 of the die 240.

Referring next to FIG. 2B, the die 240 is engaged with the supportmember 202 to form an assembly 260. More specifically, the back side 244of the die 240 is engaged with or otherwise placed in contact with theattachment feature 230 such that the assembly 260 has a chip-on-board(COB) configuration. After positioning the back side 244 of the die 240at the desired position relative to the support member 202, a heatingprocess, commonly referred to as “reflow,” is used to metallurgicallyattach the solder material 231 and the conductive layer 250 to form agenerally rigid, robust connection between the back side 244 of the die240 and the support member 202. The attachment feature 230 may or maynot be electrically coupled to internal active structures or features ofthe die 240 and/or support member 202. In the illustrated embodiment,for example, the die 240 is not electrically coupled to the supportmember 202 via the attachment feature 230. In other embodiments,however, the die 240 may be electrically coupled to one or more groundstructures or ground planes (not shown) of the support member 202 viathe attachment feature 230.

FIG. 2C illustrates a subsequent stage in the method in which aplurality of wire bonds 270 or other types of connectors are formedbetween the terminals 248 on the die 240 and corresponding supportmember terminals 208 at the first side 204 of the support member 202.Accordingly, as mentioned above, the support member 202 distributessignals from the very small terminals 248 on the die 240 to the largerarray of contact pads 212 at the second side 206 of the support member202. After forming the conductive couplers 270, an encapsulant, shell,or cap 272 can be formed or otherwise deposited onto the assembly toform a packaged microelectronic device 290. The encapsulant 272 enhancesthe integrity of the device 290 and protects the die 240 and thephysical and electrical connections between the die 240 and the supportmember 202 from moisture, chemicals, and other contaminants.

An embodiment of the method described above with reference to FIG. 2A-2Cfor forming a microelectronic device 290 includes forming an attachmentfeature 230 on at least one of the back side 244 of the die 240 and thesupport member 202. The attachment feature 230 can be composed of asolder material 231. The method can also include contacting theattachment feature 230 with the other of the die 240 and the supportmember 202, and reflowing the solder material 231 to join the die 240 tothe support member 202 via the attachment member 230. In severalembodiments, the attachment feature 230 is not electrically connected tointernal active structures (e.g., the integrated circuitry 246) of thedie 240.

Several embodiments of the microelectronic device 290 described abovewith reference to FIGS. 2A-2C may provide improved package reliabilityand robustness as compared with conventional packaged devices havinggenerally flexible connections between the die and corresponding supportmember. As discussed previously, the generally flexible or compliantconnections in conventional devices (FIGS. 1A and 1B) can allow internalcomponents of the devices to warp and/or delaminate, which in turn oftenleads to failure or malfunction of such devices. In the device 290 shownin FIG. 2C, however, the generally rigid solder-based connection betweenthe back side 244 of the die 240 and the support member 202 providesstructural support and a consistent stress distribution within thedevice 290. The rigid package construction may reduce stress within theindividual components of the device 290 and the interfaces between thecomponents, thereby reducing and/or eliminating the tendency for thedevice 290 to warp or otherwise deform.

FIGS. 3A and 3B illustrate stages of a method for forming a packagedmicroelectronic device in accordance with another embodiment of thedisclosure. More specifically, FIG. 3A is a partially schematic, sidecross-sectional view of the support member 202 and the microelectronicdie 240 at an initial stage before the die has been attached to thesupport member. This stage of the illustrated method differs from thestage described above with reference to FIG. 2A in that the supportmember 202 includes an attachment feature 330 having a differentconfiguration than the attachment feature 230 of FIG. 2A. In thisembodiment, for example, the attachment feature 330 includes a pluralityof solder balls or conductive bumps 331 disposed on the first side 204of the support member 202 in a desired pattern. The solder balls 331 maybe composed of materials similar to those discussed above with referenceto FIG. 2A, Furthermore, a volume of flux (not shown) may be depositedon to the solder balls 331 before bringing the die 240 into contact withthe solder balls 331.

Referring next to FIG. 3B, the back side 244 of the die 240 is engagedwith the solder balls 331 of the attachment feature 330 to form anassembly 360. After positioning the die 240 at a desired locationrelative to the support member 202, a suitable reflow process is used toreflow the solder balls 331 and the conductive layer 250 to form agenerally rigid connection between the back side 244 of the die 240 andthe support member 202. In the illustrated embodiment, for example, theconductive layer 250 can include a plurality of conductive pads or balls252 (shown in broken lines) arranged in a pattern at the back side 244of the die 240 corresponding at least in part to the arrangement ofsolder balls 331 on the support member 202. In other embodiments,however, the conductive layer 250 may include a wettable, metallizedlayer or another configuration suitable for wetting the solder balls331.

After reflowing the solder balls 331 and conductive layer 250, a fillmaterial 362 can be applied to the interface between the die 240 and thesupport member 202. The fill material can protect the connection formedbetween the die 240 and the support member 202 by the solder balls 331,and can prevent moisture, chemicals, and other contaminants fromentering the interstitial spaces between these components. The fillmaterial 362, for example, can wick into the spaces between the backside 244 of the die 240 and the support member 202 and around theperiphery of the die 240. The fill material 362 can include a moldingcompound, such as an epoxy resin, or other suitable materials. Afterencapsulation, the assembly 360 can undergo additional processing asdescribed above with respect to FIG. 2C to form a packagedmicroelectronic device.

Any one of the packaged microelectronic devices described above withreference to FIGS. 2A-3B can be incorporated into any of a myriad oflarger and/or more complex systems, a representative example of which issystem 400 shown schematically in FIG. 4. The system 400 can include aprocessor 402, a memory 404 (e.g., SRAM, DRAM, flash, and/or othermemory device), input/output devices 406, and/or other subsystems orcomponents 408. The microelectronic devices described above withreference to FIGS. 2A-3B may be included in any of the components shownin FIG. 4, The resulting system 400 can perform any of a wide variety ofcomputing, processing, storage, sensing, imaging, and/or otherfunctions. Accordingly, representative systems 400 include, withoutlimitation, computers and/or other data processors, for example, desktopcomputers, laptop computers, Internet appliances, hand-held devices(e.g., palm-top computers, wearable computers, cellular or mobilephones, personal digital assistants, etc.), multi-processor systems,processor-based or programmable consumer electronics, network computers,and mini computers. Other representative systems 400 include cameras,light or other radiation sensors, servers and associated serversubsystems, display devices, and/or memory devices. Components of thesystem 400 may be housed in a single unit or distributed over multiple,interconnected units (e.g., through a communications network). Thecomponents of the system 400 can accordingly include local and/or remotememory storage devices, and any of a wide variety of computer-readablemedia.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from theinvention. For example, specific elements of any of the foregoingembodiments can be combined or substituted for other elements in otherembodiments. In particular, for example, the solder-based attachmentfeature may initially be attached to the support member (as shown in theFigures) before being attached to the microelectronic die, or theattachment feature may initially be attached to the microelectronic die.Further, the solder material may have other shapes or forms in additionto, or in lieu of, the solder layer and solder balls described above.Moreover, in several embodiments one or more additional microelectronicdies can be stacked on the die 240 and electrically coupled to thecorresponding die and/or support member. Accordingly, the invention isnot limited except as by the appended claims.

We claim:
 1. A system, comprising: at least one of a processor and amemory device, wherein at least one of the processor and the memorydevice includes a semiconductor component comprising— an interposersubstrate including a plurality of first terminals; a microelectronicdie having an active side, a back side opposite the active side andfacing toward the interposer substrate, integrated circuitry, and aplurality of second terminals at the active side and electricallycoupled to the integrated circuitry, and wherein the second terminals atthe active side of the microelectronic die are electrically coupled tocorresponding first terminals of the interposer substrate with aplurality of wire bonds; and a connection structure composed of a volumeof solder material between the interposer substrate and themicroelectronic die, wherein the connection structure is attached toboth the interposer substrate and the back side of the microelectronicdie, wherein the connection structure includes at least one of (a) asingle, unitary structure covering approximately all of the back side ofthe microelectronic die, and (b) a structure electrically isolated frominternal active features of the microelectronic die.
 2. The system ofclaim 1 wherein the microelectronic die is electrically coupled to oneor more grounding structures of the interposer substrate via theconnection structure.
 3. The system of claim 1 wherein the volume ofsolder material comprises a plurality of pre-formed solder balls, andwherein the solder balls do not transmit signals between themicroelectronic die and the interposer substrate.
 4. The system of claim1 wherein the microelectronic die further comprises a conductive layerat the back side of the microelectronic die and in contact with theconnection structure.
 5. The system of claim 1 wherein the volume ofsolder material between the interposer substrate and the microelectronicdie has a generally uniform thickness.
 6. The system of claim 1, furthercomprising an encapsulant over the interposer substrate and at leastpartially covering the microelectronic die, first terminals, secondterminals, and wire bonds.
 7. The system of claim 1 wherein theconnection structure is composed of SnAgCu, SnAg, or SnAu solder.
 8. Thesystem of claim 1 wherein the connection structure is formed of alead-free solder material.
 9. The system of claim 1 wherein themicroelectronic die comprises one of an imager, a filter, or a sensor.